Integrated circuit package and method of making

ABSTRACT

An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.

BACKGROUND

Integrated circuit (“IC”) packages are ubiquitous in modern electronicdevices. A typical integrated circuit package includes an IC die(“chip”), a lead frame and a layer of protective encapsulant. Leadframes are formed by cutting a pattern cut in a thin sheet of conductivematerial such as copper. Lead frames typically come in strip form withmany identical lead frame patterns provided in a grid array on thestrip.

An IC die is a small block of semiconductor material such as silicon inwhich an electrical circuit that performs a predetermined function isprovided. Dies often have contact pads on a top surface that allow thedie circuit to be connected to external circuits.

Copper lead frames are subject to oxidation, which may cause weldedconnections thereto, such as wire bonded connections, to be subject tofailure. For this reason, copper lead frames are often plated with othermetals, such as silver, which prevents oxidation. When such metalplating is performed it is usually done prior to die mounting. Generallythe entire lead frame is plated in a single operation such as by electroplating.

The usual method of forming IC packages includes mounting a number ofidentical dies on the identical lead frame portions of a plated leadframe strip. A bottom surface of each die is attached to a centralportion of each lead frame, known as a die attach pad, usually by alayer (also sometimes referred to herein as “patch”) of epoxy. Theepoxy, when applied to the die pad, is in a paste form. The position andthe amount of epoxy applied to each die pad needs to be carefullycontrolled to prevent the epoxy from smearing and overflowing ontoadjacent regions of the lead frame, where it may interfere with otherpackaging processes. After placing each die on a corresponding patch ofepoxy paste, the lead frame strip is moved to a heat source such as acuring oven where the epoxy is cured.

After curing the epoxy, the dies are electrically connected to thecorresponding lead frames. In a typical process, contact pads on thedies are electrically connected to predetermined regions on thecorresponding lead frames by small thin wires by a process called wirebonding. A first end of each wire is typically bonded to a preselecteddie contact pad by a welding process known as first bond. A second endof each wire is typically bonded to a preselected portion of each leadframe by another bonding process known as second bond or wedge bond.Both of these bonding processes are well known and understood by thoseskilled in the art.

After wire bonding is completed the lead frame strips are moved to moldstations where a mold compound is applied that covers the dies, wirebonds and a large portion of each of the lead frames. Small end portionsof each lead frame and the web that interconnects the lead frames arenot coated with mold compound. The applied mold compound is heated untilit cures to a solid state. The cured mold compound protects theencapsulated portion of each lead frame, the associated die and wirebond connections.

After curing of mold compound, the lead frame strip is cut apart or“singulated” to separate the strip into individual IC packages. Each ICpackage includes an encapsulated lead frame and die.

After singulation the circuitry of each IC package is tested, and thosehaving circuit failures are discarded. A common cause of IC failures isbroken welds between wire bonding wires and the lead frame. Thedevelopment of production processes that reduces such defective ICpackages is a continuing goal in the industry.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top isometric view of a lead frame strip.

FIG. 2 is a top isometric view of a lead frame strip with plating.

FIG. 3 is a detail top isometric view of a lead frame with plating.

FIG. 4 is a detail bottom isometric view of the lead frame of FIG. 3.

FIG. 5 is an exploded top isometric view of a lead frame strip showingthe application of epoxy patches and dies to the lead frame strip.

FIG. 6 is a top isometric view of a lead frame strip showing dieselectrically attached to the lead frame by wire bonding.

FIG. 7 is a detail top isometric view of one lead frame and die assemblyof FIG. 6.

FIG. 8 is a top isometric view of a lead frame strip with encapsulateddies.

FIG. 9 is a top isometric view of an encapsulated lead frame strip afterplating.

FIG. 10 is a top isometric view of the lead frame strip of FIG. 9 aftersingulation.

FIG. 11 is a detailed cross-sectional view of a portion of a lead frameand epoxy paste applied thereto.

FIG. 12 is a detailed cross-sectional view of a lead frame and diecovered with encapsulant.

DETAILED DESCRIPTION

This disclosure, in general, relates to an integrated circuit device 120and a method of making it. The IC device 120, FIG. 10, may include aconductive lead frame 12 that has a die pad member 19 with a relativelylarger central body portion 20 and at least one relatively smallerperipheral portion 22, 24 in electrical continuity with the central bodyportion 20. The peripheral portion(s) 22, 24 project laterally outwardlyfrom the central body portion 20 of the die pad member 19. Eachperipheral portion 22, 24 has at least one abutment surface, e.g. 26,28, 32, 34, FIG. 3. Predetermined portions of the lead frame 12 areplated. A die 80 having a plurality of conductor pads 82, 84, 86, etc.on a top surface 81 is mounted on the lead frame 12, FIG. 7. A bottomsurface 83 of the die 80 is attached to the central body portion 20 ofthe die pad member. At least one wire 88 is bonded at a first end 89 toone of the conductor pads 82 and at a second end 91 to the peripheralportion 22 of the die pad member 19. No wire is connected between any ofthe conductor pads 82, 84, etc. and the central body portion 20. A layerof encapsulant 110 (sometimes referred to herein as “encapsulation layer110”), FIG. 12, covers the die 80 and the wire(s) 88 and most of thelead frame 12. The encapsulation layer 110 has one or more portionsengaging at least one abutment surface 26, 32 so as to resist lateraldisplacement of the peripheral portion 22 relative to the encapsulationlayer 110 in the proximity of the abutment surface(s) 26, 32. Havingthus described an embodiment of an IC device 120 generally, variousother embodiments and methods of making an IC device 120 will now bedescribed in detail.

FIG. 1 is a top isometric view of a portion of a lead frame strip 10having four separate lead frames 12 formed thereon. Each lead framestrip 10 contains multiple cutout portions which define each lead frame12, and may also contain other cutouts which facilitate movement of alead frame between various stations where different fabricationprocesses take place. Lead frame displacement and handling techniquesand equipment used for these purposes are well known to those skilled inthe art and are thus not shown or described in detail herein.

FIG. 2 illustrates the lead frame 10 of FIG. 1 after an initial platingoperation. In one embodiment, the lead frame is made from copper and theplating is silver, which may be applied by known plating processes suchas electro plating. FIGS. 3 and 4 are detailed top and bottom isometricviews of one lead frame 12 in the lead frame strip 10 of FIG. 2. As bestshown by FIGS. 3 and 4, each lead frame 12 includes a relatively large,integral die pad member 19 and two separate finger members 42, 44. Eachof the members 19, 42, 44 has generally flat top and bottom surfaces 14,16 connected by a peripheral edge surface 18. The lead frame die padmember 19 has a central body portion 20, which may have a generallyrectangular shape. The lead frame 12 further includes first and secondear portions 22, 24 which may have top and bottom surfaces generallycoplanar with the top and bottom surfaces of the central body portion20. First and second longitudinally extending grooves 26, 28 separatethe first and second ear portions 22, 24 from the central body portion20. The first ear portion 22 has a first longitudinally extending holeor slot 32 therein and the second ear portion 24 has a secondlongitudinally extending hole or slot 34 therein. Each hole/slot 32, 34extends all of the way through the respective ear portions 22, 24. Inone embodiment, each of the grooves 26, 28 has a semicircular crosssection that may have a radius of about 0.15 mm. Each of the grooves 26,28 may have a length of about 2 mm to 3 mm. In one embodiment each slot32. 34 may have a width of about 0.3 mm and a length of about 2 mm. Atypical lead frame thickness range is about 0.2 mm to 0.3 mm.

The die pad member 19 may also include a first longitudinally extendingtab portion 35 and a second longitudinally extending tab portion 36 thatare integrally connected to the central body portion 20 at oppositelongitudinal ends thereof. The two tab portions 35, 36 interface withthe central body portion 20 along first and second longitudinallyextending grooves 37, 38. The second longitudinally extending groove 38may have a laterally extending hole/slot 39 centered therein as bestshown in FIGS. 3 and 4. In one embodiment the grooves 37, 38 may havecross sections similar in size and shape to the grooves 26, 28.

First and second generally longitudinally extending finger members 42,44 have inner edge surfaces 45 that extend parallel to the outer edgesurfaces 18 of each ear portion 22, 24. Each oppositely positioned pairof surfaces 45, 18 may have a bend therein which in one embodiment maybe about 135°. The opposite surfaces 45, 18 may thus define a hockeystick shaped opening 50 there between. It may be seen from FIGS. 1 and 2that the first longitudinally extending tab portion 35 and each of thefinger portions 42, 44 are connected to a common laterally extending rib40 prior to singulation from the lead frame strip 10. However, aftersingulation, as discussed below with reference to FIGS. 9 and 10, theintegral die pad member 19 and the two finger members 42, 44 are nolonger integrally connected.

As best illustrated in FIG. 3, plating material 51 is selectivelyapplied to the two finger members 42, 44 and the two ear portions 22,24. A silver plated region 52 of the first ear portion 22 may be alongitudinally extending strip having as borders the outer edge of theear portion 22 and the outer edge of the longitudinal slot 32 and alinear projection thereof and the opposite longitudinal ends of the earportion 22. A silver plated region 54 of the second ear portion 24 maybe provided in a substantially mirror image relationship with the silverplated region 52 on the first ear portion 22. The silver plated regions52, 54 may be applied only to the top surface of the ear portions 22,24. A silver plated region 56, 58 may also be provided on each of thefinger members 42, 44 on a top surface thereof and may cover the entiretop surface of each finger region down to a line approximately alignedwith the lower edge of the central body portion 20. Each silver platedregion 52, 54, 56, 58 is adapted to have lead wires welded thereto asdescribed in further detail below. Silver plating of copper preventsoxidation of the underlying copper. Generally, wire bonds made to silverplated copper lead frame portions are less subject to failure than wirebonds made directly to copper. However epoxy does not adhere well tosilver plated copper. Applicants have optimized wire bond welds byselectively plating regions that are to have wire bond welds madethereon. Applicants have optimized epoxy adhesion to the central bodyportion 20 by not silver plating this region.

FIG. 5 is a top isometric view of the lead frame strip 10 showing theposition of epoxy patch or layer 70 and dies 80 that are applied to thecentral body portion 20 of each lead frame 12. The epoxy patch may beapplied by conventional means such as an epoxy liquid dispensing syringe(not shown). Each die 80 may be positioned on a corresponding epoxylayer 70 by conventional means such as a pick and place machine (notshown). The epoxy layers 70 may be conventionally cured as with a curingoven.

As shown by FIGS. 6 and 7, after each die 80 is mounted on theassociated epoxy patch 70 and after the epoxy has cured, conductor pads82, 84, 86, etc., on the die 80 are electrically connected topreselected silver plated regions 52, 54, 56, 58 on the ear portions 22,24 and finger members 42, 44. The electrical connections may be made bywire bonding. A first end 89 of each of the lead wires 88, 84, 86 isattached to a conductor pad 82, 84, 86, etc. on the die 80. The secondend 91 of each lead wire 88, 84 86 is welded to a predetermined one ofthe silver plated regions 52, 54, 56, 58. It should be noted that noneof the silver plated regions 52, 54, 56, 58 are located on the centralbody portion 20. Thus none of the lead wires 88, 90, 92, 94, 96, 98 areconnected to the central body portion 20 of the lead frame 12. Wirebonding connections are well known to those skilled in the art.

After leaving the wire bonding station, the strip 10 is next moved to anencapsulation apparatus such as a transfer mold (not shown). Protectivematerial such as epoxy encapsulant layer 110 is s applied to the leadframe strip 10 so as to completely cover the die 80 and wires 88, 90,92, 94, 96, 98. The central body portion 20 and finger members 42, 44are also covered with encapsulant, except for laterally outer portions112, 114, 116, 118 thereof. Next, as illustrated in FIG. 9, the portionof the lead frame strip 10 that is not covered by encapsulation layer110 is tin plated, and thus the exposed end portions 112, 114, 116, 118are tin plated.

As illustrated by FIG. 10, the lead frame strip 10 is next singulated toseparate the portions 112, 114, 116, 118 from the rest of lead framestrip so as to create a plurality of integrated circuit (“IC”) devices120 having IC terminals 112A, 114A, 116A, 118A.

The functions of certain structures of each lead frame 12 will now bedescribed with reference to FIGS. 11 and 12. FIG. 11 is a crosssectional view of a lead frame 12 after application of an epoxy patchlayer 70 thereto. Epoxy, before curing, is in a liquid stage and has atendency to flow in all directions including into areas not covered bythe die and into areas where lead wires will eventually be attached,which is undesirable. As illustrated by FIG. 11, the longitudinalgrooves 26, 28 tend to prevent this from happening. Terminal edges 111,113 constrain the outward flow of epoxy because the surface tension ofthe epoxy causes it to form a meniscus 72 at each edge, which resistsoutward travel of the epoxy. The grooves 26, 28 also help by providing areservoir for the epoxy to flow into in the event that the flowresisting force of the meniscus is overcome. In other words the epoxy 70will flow into the cavity provided by each of the grooves 26, 28 ratherthan flowing onto the surface of each of the ear portions 22, 24.

FIG. 12 shows a cross section of one lateral half of a completed ICdevice 120 showing central portion 20, ear portion 22, finger portion 42and the epoxy layer 70 and die 80 mounted on the central body portion20. The lead wires 88, etc., attached to the top surface 14 of the die80 and the silver plated portions 52, 56 of the ear portion 22 andfinger member 42 are also covered by encapsulation layer 110. Theencapsulant which forms encapsulation layer 110, when it is in a liquidstate in the transfer mold, flows into each of the longitudinal grooves26 and through the hole/slot 32 and through the opening 50 between theear portion 22 and the finger member 42. After the encapsulant has curedand solidified, the portion of the encapsulation layer 110 positionedwithin groove 26, hole/slot 32 and opening 50 locks the encapsulationlayer 110 against displacement with respect to the ear portion 22 andfinger member 42. After the encapsulation layer has solidified aroundthe lead frame 12, there is a tendency for the lead frame 12 to separatefrom the adjacent area of the encapsulation layer 110 during thermalcycles, due to the greater expansion rate of copper as compared to theexpansion rate of encapsulant. Applicant has discovered that inconventional encapsulated dies, this relative displacement of the leadframe 12 with respect to the encapsulation layer 110 can cause the leadwire welds to break. However, due to the locking action of the groove26, slot 32 and opening 50 in applicants' lead frame 12 there isrelatively little displacement. In other words the surface portions ofthe encapsulant layer 110 that abut the surfaces of the lead frame 12that define these openings 26, 32, 50, keeps the adjacent portion of thelead frame 12 relatively fixed with respect to the encapsulation layer110. As a result, there is very little displacement of the encapsulationlayer 110 relative to the wire welds 89, 91, 93, etc. on the lead frame112. Thus, these wire welds are not damaged and a major cause of ICfailure is obviated.

Although certain embodiments of an encapsulated integrated circuit(“IC”) assembly and a method of making such an assembly have beendescribed in detail herein, it is to be understood that the assembly andmethod are not limited to these specific embodiments and may beotherwise constructed. It is intended that the appended claims bebroadly construed so as to encompass such alternative embodiments,except to the extent limited by the prior art.

What is claimed is:
 1. An integrated circuit device comprising: aconductive lead frame having a die pad that comprises: a relativelylarger central body portion; at least one relatively smaller peripheralportion in electrical continuity with said central body portion andprojecting laterally outwardly from said central body portion and havingat least one abutment surface thereon, wherein said at least onerelatively smaller peripheral portion comprises a first ear projectingfrom a first lateral side of said central body portion and a second earprojecting from a second lateral side of said central body portion andwherein said at least one abutment surface comprises a surface defininga first groove in said first ear and a surface defining a second groovein said second ear; a die having a plurality of conductor pads on a topsurface thereof and having a bottom surface attached to said centralbody portion; at least one wire bonded at a first end thereof to one ofsaid conductor pads and at a second end thereof to said at least oneperipheral portion, and wherein no lead wire is connected between any ofsaid conductor pads and said central body portion; and an encapsulationlayer covering said die, said wires and at least a portion of said leadframe and having a portion abuttingly engaging said at least oneabutment surface so as to resist lateral displacement of said peripheralportion relative to said encapsulation layer in the proximity of said atleast one abutment surface.
 2. The integrated circuit device of claim 1wherein said at least one peripheral portion comprises a plated portionand wherein said central body portion comprises no plated portion. 3.The integrated circuit device of claim 2 wherein said at least one ofsaid wire ends connected to said at least one peripheral portion isconnected to said plated portion of said peripheral portion.
 4. Theintegrated circuit device of claim 1, wherein said at least one abutmentsurface comprises a surface defining a first hole in said first ear anda surface defining a second hole in said second ear.
 5. The integratedcircuit device of claim 1 further comprising: a first plated region onsaid first ear and a second plated region on said second ear.
 6. Theintegrated circuit device of claim 5 wherein each of said first andsecond plated regions are positioned laterally outwardly of said firstand second holes, respectively.
 7. The integrated circuit device of 1wherein said lead frame further comprises at least one finger positionednot connected to said at least one peripheral portion and laterallyseparated therefrom by a space filled by said encapsulation layer. 8.The integrated circuit device of claim 7 wherein said at least onefinger comprises a plated portion.